ESC DESIGN PARAMETERS
Size & Geometry
100mm - 450mm; Custom design base plates
Material
Anodize Aluminum, Alumina, DLC, SIN, SiO2, Ti
Electrode Designs
Monopole, Dipole, Multi-pole, Interdigitated
Geometric Tolerance
Surface Finish
Wafer clamping surface <2μ inch Ra (0.05μm)
Surface Patterning
Custom mesa pattern to reduce particle transfer
Refurbishments
Ceramic ESC surface cleaning, removal & replacement
Inspection & Performance Testing
Dimensional accuracy, Electrical performance, Vacuum integrity, Backside gas leakage, Wafer clamping and Release
Analysis Capability
Thermal & Electrical Performance, SEM & EDX using FEM & CFD
Production Volume
Prototype to High Volume
Industry Focus
Tool Manufacturers
Semiconductor
Lithography
Solar
LED
MEMS
Applications
Etch Process
HPD-CVD and PVD
Ion Implantation
Metrology
Dielectric Substrates
(LED and Solar Applications)
Industry Standards
Compliant to Major OEM Specifications including Quality, Packaging, Performance, and Cleanliness
File Formats
Available to import most software; Solidworks, IGES, STEP, DXF